标准摘要
[中文适用范围]： 本文件适用于通过涂覆、灌封或模塑保护以防止污染的组件，从而允许减少 IEC 60664-1 中描述的电气间隙和爬电距离。本文件描述了两种保护方法的要求和测试程序：类型 1 保护改善了受保护部件的微观环境；类型 2 保护被认为类似于固体绝缘。本文件还适用于所有类型的受保护印刷电路板，包括多层电路板的内层表面、基板及类似受保护的组件。对于多层印刷电路板，通过内层的距离由 IEC 60664-1 中关于固体绝缘的要求涵盖。本文件仅指永久保护。它不适用于受机械调整或维修的组件。本标准的原则适用于功能性绝缘、基本绝缘、补充绝缘和加强绝缘。 [外文原描述]： IEC 60664-3:2016 applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in IEC 60664-1. This document describes the requirements and test procedures for two methods of protection: - type 1 protection improves the microenvironment of the parts under the protection; - type 2 protection is considered to be similar to solid insulation. This edition includes the following significant technical changes with respect to the previous edition: a) information added concerning interpolation; b) provided scratch test is only for type 2 protection; c) renumbered the scratch test to follow the visual examination test, since it makes more sense there; d) separated the tables under what is now called Annex A, to make them clearer.
英文名称Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution