半导体器件 集成电路 第2-12部分：数字集成电路 可编程逻辑器件（PLDs）空白详细规范

[中文适用范围]： 半导体器件 - 集成电路 - 第 2-12 部分：数字集成电路 - 可编程逻辑器件 (PLD) 的空白详细规范 标记和订购信息................................ ...................................................... 1.1标记................................................ ...................................................... . 1.2 订购信息................................................................ ...................................... 应用相关说明............ ...................................................... ...................... 功能说明...................................... ................................................ 3.1 框图。 ...................................................... ...................................................... 3.2 端子的识别和功能...... ................................................ 3.3 功能描述................................................. ...................................... 3.4 家庭相关特征................................ ...................................................... . 极限值（绝对最大额定值系统）................................................ ... 工作条件（在规定的工作温度范围内）............ 电气特性............ ...................................................... 6.1 静态特性................................................ ...................................................... 6.2 动态特性........................ ...................................................... 6.3 时序图................................. ...................................................... 6.4 电容................................................. ...................................................... ..... 编程............................................ ...................................................... 7.1 编程模式........................................ ................................................ 7.2 擦除模式（如果适用）。 ...................................................... 7.3 编程-擦除周期数（如果适用）................. 7.4数据保留信息...................................................... ......................... 附加信息....................... ...................................................... ................. 筛查（如果需要）......................................... ...................................................... ...... 质量评估程序...................................................... ...................................... 10.1 资质审批程序............ ................................................................ 10.2 能力批准程序。 ...................................................... ...... 结构相似性程序...................................... ...................................... 试验条件和检验要求............ ...................................................... 12.1 概述... ...................................................... 12.2 抽样要求和检验批的形成................................................ 12.3 检验表................................. ...................................................... ................................. 12.4 延迟交货........................................ ...................................................... ....附加测量方法...................................................... ...................................... 13.1 数据保留测试（破坏性测试）........................ ...................................................... 13.2 写入/擦除耐久性：写入次数编程周期（破坏性测试） 13.3 可编程性........................................................ ………………………………