标准摘要
[中文适用范围]： 目的是检查薄膜和混合集成电路的内部材料、结构和工艺。这些检查通常在攻丝或封装之前使用，以检测和消除具有内部缺陷的 F 和 HFIC [外文原描述]： The purpose of these examinations is to check the internal materials, construction and workmanship of film and hybrid integrated circuits (F and HFICs). These examinations will normally be used prior to tapping or encapsulation to detect and eliminate the F and HFICs with internal defects that could lead to device failure in normal application. Other acceptance criteria may be agreed upon with the purchaser or supplier, respectively.
英文名称Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination