标准摘要
[中文适用范围]： 还涵盖部分完成的薄膜集成电路和混合薄膜集成电路，包括有源和无源，提供给客户进行后续加工，不包括印刷电路板，但适用于上述可能的薄膜电路 [外文原描述]： Applies to film integrated circuits and to hybrid film integrated circuits both passive and active. Applies also to partly-completed F and HFICs supplied to customers for subsequent processing as well as to chip carrier circuits having more than one chip, provided that they have been interconnected by film interconnection techniques. This specification defines the quality assessment procedures and the methods for electrical, climatic, mechanical and endurance tests. It outlines the requirements which shall be applied to the release of circuits using either qualification approval procedures or capability approval procedures.
英文名称Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits