标准摘要
[中文适用范围]： 半导体器件 - 集成电路 - 第 22-1 部分：基于能力批准程序的薄膜集成电路和混合薄膜集成电路的空白详细规范 特性和使用条件............ ...................................................... ...... 推荐的安装方法...................................... ...................... 标记...................... ...................................................... .......................................... 订购信息...... ...................................................... ................................................ 放行批次的认证记录....... ...................................................... .................. 附加信息.............................. ...................................................... …………通用和/或分规范中规定的附加或增加的严重性或要求……………… ...................................................... .................检验要求（见表2和表3或表4和表5）......................... …………补充-方法B表................................. ………………………………
英文名称Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures