标准摘要
[中文适用范围]： IEC 60749 的这一部分描述了一种冲击测试，旨在确定电子设备中使用的零部件的适用性，这些电子设备可能会因粗暴搬运、运输或操作而产生的突然施加的力或突然的运动变化而遭受中等程度的严重冲击。现场操作。这种类型的冲击可能会干扰操作特性，特别是当冲击脉冲重复时。这是一个破坏性的测试。它通常适用于空腔型封装。一般来说，该机械冲击测试符合 IEC 60068-2-27，但由于半导体的特殊要求，该标准的条款适用。 [外文原描述]： Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages. The contents of the corrigendum of August 2003 have been included in this copy.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock