标准摘要
[中文适用范围]： IEC 60749的本部分定义了温度快速变化测试方法和两液浴方法。当两种测试方法都作为设备鉴定的一部分进行时，空气到空气温度循环的结果优先于这种双流体浴测试方法。该测试方法还可以使用较少的循环（例如5至10个循环）来测试浸没在用于清洁装置的加热液体中的效果。该测试适用于所有半导体器件。除非相关规范中另有详细说明，否则它被认为是破坏性的。一般来说，这种温度快速变化和两液浴法测试符合 IEC 60068-2-14，但由于半导体的特殊要求，适用本标准的条款。 [外文原描述]： Defines the rapid change of temperature test method and the two-fluid-bath method. This test method may also be used, employing fewer cycles, to test the effect of immersion in heated liquids that are used for the purpose of cleaning devices. This test is applicable to all semiconductor devices. It is considered destructive unless otherwise detailed in the relevant specification. The contents of the corrigenda of January 2003 and August 2003 have been included in this copy.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method