标准摘要
[中文适用范围]： IEC 60749 的这一部分描述了一项测试，以确定指定频率范围内的变频振动对内部结构元件的影响。这是一个破坏性的测试。它通常适用于空腔型封装。一般来说，这种变频振动测试符合 IEC 60068-2-6，但由于半导体的特殊要求，适用本标准的条款。 [外文原描述]： Describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It is normally applicable to cavity-type packages. The contents of the corrigendum of August 2003 have been included in this copy.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency