标准摘要
[中文适用范围]： IEC 60749 的这一部分描述了一项测试，以确定指定频率范围@内的变频振动@对内部结构元件的影响。这是一个破坏性的测试。它通常适用于空腔型封装。注：该测试方法描述了扫频正弦测试。 JEDEC 文档 JESD 22-B103 中描述了随机振动测试。 [外文原描述]： IEC 60749-12:2017 describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It is normally applicable to cavity-type packages This second edition cancels and replaces the first edition published in 2002. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) alignment with MIL-STD-883J Method 2007, Vibration, variable frequency.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency