标准摘要
[中文适用范围]： 当由于电路板组装错误而导致引线弯曲时，提供各种测试来确定引线/封装接口与引线本身之间的完整性，然后对零件进行返工以进行重新组装。适用于所有通孔器件和 [外文原描述]： Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)