标准摘要
[中文适用范围]： IEC 60749 的这一部分描述了一项测试，用于确定用于通孔安装的封装固态器件是否能够承受使用波峰焊或烙铁焊接其引线期间所受温度的影响。为了建立最具可重复性的方法的标准测试程序，使用浸焊法，因为其条件更可控。该程序确定设备是否能够承受印刷线路板组装操作中遇到的焊接温度，而不会降低其电气特性或内部连接。该测试具有破坏性，可用于鉴定、批次验收以及作为产品监控。该测试总体上符合 IEC 60068-2-20，但由于半导体的特殊要求，适用本标准的条款。 [外文原描述]： IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices