标准摘要
[中文适用范围]： 本部分IEC 60749描述了一种测试，用于确定用于通孔安装的封装固态器件是否能够承受在波峰焊其引线时所受温度的影响。为了建立标准测试程序以获得最可重复的方法，使用浸焊法是因为其更可控的条件。此程序确定器件是否能够承受印刷线路板组装操作中遇到的焊接温度，而不降低其电气特性或内部连接。该测试是破坏性的，可用于资格认证、批次验收和产品监控。热量通过引线从板的反面传导到器件封装中。此程序不模拟波峰焊或回流热暴露在封装体同一侧的板上。 [外文原描述]： IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3, Terms and definitions; - clarification of the use of a soldering iron for producing the heating effect; - inclusion an option to use accelerated ageing.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices