标准摘要
[中文适用范围]： 定义旨在检测空腔器件内是否存在松散颗粒的测试，例如陶瓷碎片、键合线或焊球（颗粒）。 [外文原描述]： Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)