标准摘要
[中文适用范围]： This part of IEC 60749 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term 'semiconductor die' should be taken to include passive elements). This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. [外文原描述]： IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength