标准摘要
[中文适用范围]： 本部分适用于半导体器件的低气压试验。本项试验的口的是测定元器件和材料避免电击穿失效的能力，而这种失效是由于气压减小时，空气和其他绝缘材料的绝缘强度减弱所造成的。本顶试验仅适用于，工作电压超过1 000 V的器件。 本项试验适用于所有的空封半导体器件。本试验仪适用于军事和空间领域。 本项低气压试验方法和IEC 60068-2-13大体上一致，但鉴于半导体器件的特殊要求，使用本部分条款。 [外文原描述]： Covers the testing of low air pressure on semiconductor devices. The test is intended primarily to determine the ability of component parts and materials to avoid voltage breakdown failures due to the reduced dielectric strength of air and other insulating materials at reduced pressures is only applicable to devices where the operating voltage exceeds 1 000 V. This test is applicable to all semiconductor devices provided they are in cavity type packages. The test is intended for military and space-related applications only. The contents of the corrigendum of August 2003 have been included in this copy.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure