标准摘要
[中文适用范围]： 本部分IEC 60749适用于所有在PCB组装过程中经受批量回流焊工艺的非气密性SMD封装，包括塑料封装器件、工艺敏感器件以及其他由透湿材料（环氧树脂、硅胶等）制成并暴露在环境空气中的湿敏器件。 本文件的目的是为SMD制造商和用户提供标准化的方法，用于处理、包装、运输和使用已按照IEC 60749-20定义的级别分类的湿敏/回流敏感SMD。这些方法旨在避免因吸湿和暴露于回流焊温度而导致的损坏，这些损坏可能导致良率和可靠性下降。通过使用这些程序，可以实现安全无损伤的回流焊，干燥包装工艺提供了从密封日期起在密封干燥袋中的最小保质期能力。 在IEC 60749-20的回流焊热测试中规定了两种测试条件，方法A和方法B。对于方法A，湿气浸泡条件是在假设湿气屏障袋内的湿度含量低于30% RH的情况下指定的。对于方法B，湿气浸泡条件是在假设制造商的暴露时间（MET）不超过24小时且湿气屏障袋内的湿度含量低于10% RH的情况下指定的。在实际处理环境中，通过方法A测试的SMD允许吸收高达30% RH的湿气，而通过方法B测试的SMD允许吸收高达10% RH的湿气。本文件规定了经受上述测试条件的SMD的处理条件。 注：气密性SMD封装不湿敏，不需要湿气预防处理。 [外文原描述]： IEC 60749-20-1:2019 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition: - updates to subclauses to better align the test method with IPC/JEDEC J-STD-033C, including new sections on aqueous cleaning and dry pack precautions; - addition of two annexes on colorimetric testing of HIC (humidity indicator card) and derivation of bake tables.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat