半导体器件 - 机械和气候测试方法 - 第20-1部分:表面贴装装置的处理 包装 标签和运输对水分和焊接热的综合影响敏感

[中文适用范围]： IEC 60749-20-1适用于所有在印刷电路板组装过程中进行批量回流焊接的器件，包括塑料封装器件、工艺敏感器件以及其他使用吸湿材料（如环氧树脂、硅酮等）制成的并暴露在环境空气中的湿敏器件。本文件旨在为湿/回流敏感的表面贴装器件（SMD）的制造商和用户提供标准化的处理、包装、运输和使用方法，这些器件已根据IEC 60749-20定义了等级。采用这些方法可以避免因吸湿和暴露于回流焊接温度而导致的产量和可靠性下降。通过使用这些程序，利用干包装工艺，可以从封缄日期起提供密封干袋中的最小 shelf life（货架寿命）能力。 [外文原描述]： IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition: - updates to subclauses to better align the test method with IPC/JEDEC J-STD-033C, including new sections on aqueous cleaning and dry pack precautions; - addition of two annexes on colorimetric testing of HIC (humidity indicator card) and derivation of bake tables.