标准摘要
[中文适用范围]： 修改有效期：现为2007年。 [外文原描述]： Modification of the validity date: now put at 2007.
英文名称Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat