标准摘要
[中文适用范围]： 适用于半导体器件（分立器件和集成电路） - 并提供了一种评估塑料封装表面贴装器件的耐焊接热性的方法。 [外文原描述]： Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices. The contents of the corrigendum of August 2003 have been included in this copy.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat