标准摘要
[中文适用范围]： 本部分的 IEC 60749 提供了一种评估塑料封装表面贴装器件（SMD）焊接热耐受能力的方法。该测试为破坏性测试。 [外文原描述]： IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat