标准摘要
[中文适用范围]： 本部分IEC 60749建立了一种标准程序，用于确定旨在使用锡铅（SnPb）或无铅（Pb-free）焊料连接至另一表面的器件封装端子的可焊性。该测试方法提供了通孔、轴向和表面贴装器件（SMD）的“浸渍并目视检查”可焊性测试程序，以及用于SMD的板级安装可焊性测试的可选程序，目的是允许模拟器件应用中使用的焊接过程。该测试方法还提供了可选的老化条件。除非相关规范另有说明，否则该测试被视为破坏性测试。注1：该测试方法总体上符合IEC 60068，但由于半导体的特定要求，适用以下文本。注2：该测试方法不评估焊接过程中可能产生的热应力的影响。应参考IEC 60749-15或IEC 60749-20。 [外文原描述]： IEC 60749-21:2011 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification. NOTE 1 This test method is in general accord with IEC 60068, but due to specific requirements of semiconductors, the following text is applied. NOTE 2 This test method does not assess the effect of thermal stresses which may occur during the soldering process. Reference should be made IEC 60749-15 or IEC 60749-20. This standard cancels and replaces the first edition published in 2004 and constitutes a technical revision. The significant change is the inclusion of Pb (lead)-free backward compatibility.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability