标准摘要
[中文适用范围]： IEC 60749-21:2025 RLV包含官方的IEC国际标准及其红线版本。红线版本仅提供英文版本，便于用户快速、直观地比较当前IEC标准与上一版之间的所有变更。IEC 60749-21:2025规定了一种标准程序，用于评估设备封装端子的可焊性，这些端子在使用锡铅（SnPb）或无铅（Pb-free）焊料进行连接时，需与其他表面结合。该测试方法为通孔、轴向和表面贴装器件（SMD）提供了“浸锡观察”可焊性测试程序，并提供一种可选的板载可焊性测试程序，以便模拟器件应用中所使用的焊接过程。测试方法还提供可选的老化条件。除非相关规范中有特别说明，否则该测试被视为破坏性测试。 注1：本测试方法不评估焊接过程中可能出现的热应力影响。更详细的信息可参考IEC 60749-15或IEC 60749-20。 注2：如需使用定性测试方法，可参考IEC 60068-2-69中的润湿平衡测试方法。 与上一版相比，本版包括以下重大技术变更： - 根据当前工作实践对某些操作条件进行了修订。 [外文原描述]： IEC 60749-21:2025 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-21:2025 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for “dip and look” solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification. NOTE 1 This test method does not assess the effect of thermal stresses which can occur during the soldering process. More details can be found in IEC 60749‑15 or IEC 60749‑20. NOTE 2 If a qualitative test method is preferred, the Wetting balance test method can be found in IEC 60068-2-69. This edition includes the following significant technical changes with respect to the previous edition: - revision to certain operating conditions in line with current working practices.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability