半导体器件 机械和气候试验方法 第22-1部分：键合强度 引线键合拉力试验方法

[中文适用范围]： IEC 60749-22-1:2025 提供了一种方法，用于确定焊线与芯片或封装件的键合表面之间的连接强度及失效模式，该测试可在未封装或已开封的器件上进行。此测试方法适用于直径在15 µm至76 µm（0.000 6"至0.003"）之间的金合金、铜合金和银合金热声焊线（球焊和缝焊）；以及直径在18 µm至600 µm（0.000 7"至0.024"）之间的金合金、铜合金和铝合金超声焊线（楔形焊）。该焊线拉力测试方法为破坏性测试，适用于工艺开发、工艺控制或质量保证。该测试方法允许采用两种不同的拉线方式：a）一种方法使用钩子，将其放置在焊线下方后进行拉力测试；b）另一种方法是在焊线被切断后，将夹具夹在待测试的焊线连接部位上，然后进行拉力测试。该测试方法不包括使用焊线剪切测试进行键合强度测试，焊线剪切测试详见IEC 60749-22-2。本版标准与IEC 60749-22-2:2025第一版一同发布，取代了2002年发布的IEC 60749-22第一版。本版标准相较于前一版，进行了以下重大技术更新：a）全面更新，包括新的技术及使用新材料（例如铜线）的说明，并将其拆分为两个独立的子部分（本文档与IEC 60749-22-2）。本国际标准应与IEC 60749-22-2:2025联合使用。 [外文原描述]： IEC 60749-22-1:2025 provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and can be performed on unencapsulated or decapsulated devices. This test method can be performed on gold alloy, copper alloy, and silver alloy thermosonic (ball and stitch) bonds made of wire ranging in diameter from 15 µm to 76 µm (0,000 6" to 0,003"); and on gold alloy, copper alloy, and aluminium alloy ultrasonic (wedge) bonds made of wire ranging in diameter from 18 µm to 600 µm (0,000 7" to 0,024"). This wire bond pull test method is destructive. It is appropriate for use in process development, process control, or quality assurance. This test method allows for two distinct methods of pulling wires: a) One method incorporates the use of a hook that is placed under the wire and is then pulled. b) One method requires that after the wire be cut, a clamp is placed on the wire connected to the bond to be tested, and this clamp is used to pull the wire. This test method does not include bond strength testing using wire bond shear testing. Wire bond shear testing is described in IEC 60749-22-2. This first edition, together with the first edition of IEC 60749-22-2:2025, cancels and replaces the first edition of IEC 60749-22 published in 2002. This edition includes the following significant technical changes with respect to the previous edition: a) Major update, including new techniques and use of new materials (e.g. copper wire) involving a complete rewrite as two separate subparts (this document and IEC 60749-22-2). This International Standard is to be used in conjunction with IEC 60749-22-2:2025.