标准摘要
[中文适用范围]： IEC 60749-22-2:2025规定了一种测定球形键与芯片或封装键合表面之间强度的方法，该方法既可用于封装前的器件，也可用于封装后的器件。这种键合强度的测量对于确定两个特征至关重要：a) 已形成的冶金键的完整性，b) 球形键与芯片或封装键合表面的质量。本测试方法涵盖了使用直径在15微米至76微米（0.0006英寸至0.003英寸）之间的细小直径导线制成的热声（球形）键。本测试方法仅适用于键足够大，能够保证与剪切测试凿子良好接触，并且没有相邻结构妨碍凿子移动的情况。为了获得一致的剪切测试结果，球形键的高度至少应为4.0微米（0.0006英寸），这是本修订发布时球形键剪切测试设备当前的技术水平。本测试方法还可用于已经移除导线的球形键，以及在其上放置第二根键合导线（通常为缝合键）的情况。这种情况被称为“在球上缝合”和“反向键合”。有关更多信息，请参见附录A。导线键剪切测试是一种破坏性测试，适用于工艺开发、工艺控制或质量保证，或两者皆可。本测试方法也可用于超声波（楔形）键，但尚未证明其在键合完整性方面的指示作用一致。有关在楔形键上进行剪切测试的信息，请参见附录B。本测试方法不包括使用导线拉伸测试进行的键强度测试。导线拉伸测试在IEC 60749-22-1中有描述。本第一版，连同IEC 60749-22-1的第一版，替代了2002年发布的IEC 60749-22第一版。本国际标准应与IEC 60749-22-1:2025配合使用。与前一版相比，本版包含了以下重大技术变更：a) 全面更新，包括新的技术以及使用新材料（如铜线）的新方法，整篇文档重写为两个独立的子部分（本文件和IEC 60749-22-1）。 [外文原描述]： IEC 60749-22-2:2025 establishes a means for determining the strength of a ball bond to a die or package bonding surface and can be performed on pre-encapsulation or post-encapsulation devices. This measure of bond strength is extremely important in determining two features: a) the integrity of the metallurgical bond which has been formed, and b) the quality of ball bonds to die or package bonding surfaces. This test method covers thermosonic (ball) bonds made with small diameter wire from 15 µm to 76 µm (0,000 6" to 0,003"). This test method can only be used when the bonds are large enough to allow for proper contact with the shear test chisel and when there are no adjacent interfering structures that would hinder the movement of the chisel. For consistent shear results the ball height will be at least 4,0 µm (0,000 6 ") for ball bonds, which is the current state of the art for bond shear test equipment at the time of this revision. This test method can also be used on ball bonds that have had their wire removed and on to which a second bond wire (typically a stitch bond) is placed. This is known as "stitch on ball" and "reverse bonding". See Annex A for additional information. The wire bond shear test is destructive. It is appropriate for use in process development, process control, or quality assurance, or both. This test method can be used on ultrasonic (wedge) bonds, however its use has not been shown to be a consistent indicator of bond integrity. See Annex B for information on performing shear testing on wedge bonds. This test method does not include bond strength testing using wire bond pull testing. Wire bond pull testing is described in IEC 60749-22-1. This first edition, together with the first edition of IEC 60749-22-1, cancels and replaces the first edition IEC 60749-22 published in 2002. This International Standard is to be used in conjunction with IEC 60749-22-1:2025. This edition includes the following significant technical changes with respect to the previous edition: a) Major update, including new techniques and use of new materials (e.g. copper wire) involving a complete rewrite as two separate subparts (this document and IEC 60749‑22‑1).
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods