标准摘要
[中文适用范围]： 该测试用于确定偏置条件和温度随时间对固态器件的影响。它以加速方式模拟设备运行状况，主要用于设备鉴定和可靠性监控。 [外文原描述]： This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life