标准摘要
[中文适用范围]： IEC 60749-23:2025 RLV包含官方的IEC国际标准及其红线版本。红线版本仅提供英文版，可帮助您快速、便捷地比较官方IEC标准与其前一版之间的所有更改。IEC 60749-23:2025规定了用于确定偏置条件和温度随时间对固态器件影响的测试方法。该测试以加速方式模拟器件的工作条件，主要用于器件的认证和可靠性监控。一种使用短时间的高温偏置寿命测试，俗称“老化筛选”，可用于筛选与早期失效相关的故障。老化筛选的具体应用和使用范围不在本文档的范围内。与前一版相比，本版包含以下重大技术变更：a) 绝对应力测试定义及相应的测试时长已更新。 [外文原描述]： IEC 60749-23:2025 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-23:2025 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document. This edition includes the following significant technical changes with respect to the previous edition: a) absolute stress test definitions and resultant test durations have been updated.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life