标准摘要
[中文适用范围]： IEC 60749-23:2025 规定了用于确定偏置条件和温度随时间对固态器件影响的测试方法。它以加速方式模拟器件的操作条件，主要用于器件的认证和可靠性监控。一种称为“老化筛选”（burn-in）的高温偏置寿命测试，通过短时间的高应力测试，可以用于筛选早期失效相关的问题。本文件不涵盖“老化筛选”的详细使用和应用。与前一版相比，本版包含以下重大技术变更：a）绝对应力测试的定义及相应的测试时间已进行了更新。 [外文原描述]： IEC 60749-23:2025 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document. This edition includes the following significant technical changes with respect to the previous edition: a) absolute stress test definitions and resultant test durations have been updated.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life