标准摘要
[中文适用范围]： 提供了一种测试程序，用于确定半导体器件和组件和/或电路板组件承受由交替的高温和低温极端温度引起的机械应力的能力。电气和/或物理的永久变化 [外文原描述]： Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling