标准摘要
[中文适用范围]： IEC 60749 的这一部分建立了根据器件和微电路暴露于定义的场感应带电器件模型 (CDM) 静电放电 (ESD) 造成损坏或退化的敏感性（敏感性）来测试、评估和分类器件和微电路的程序。所有封装半导体器件、薄膜电路、表面声波 (SAW) 器件、光电器件、混合集成电路 (HIC) 以及包含任何这些器件的多芯片模块 (MCM) 均应根据本文件进行评估。为了执行测试，设备被组装成类似于最终应用中预期的封装。本 CDM 文件不适用于插座放电模型测试仪。本文档描述了场感应 (FI) 方法。另一种方法是直接接触 (DC) 方法，如附录 I 中所述。本文件的目的是建立一种测试方法，该方法将复制 CDM 故障并提供可靠、可重复的 CDM ESD 测试结果，无论设备如何类型。可重复的数据将允许对 CDM ESD 敏感度级别进行准确的分类和比较。 [外文原描述]： IEC 60749-28:2017(E) establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex I. The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level