半导体器件.机械和气候试验方法.第28部分:静电放电（ESD）灵敏度试验.带电器件模型（CDM）.器件级

[中文适用范围]： 本部分 IEC 60749 规定了根据器件和微电路对定义的场诱导带电器件模型(CDM)静电放电(ESD)的损坏或退化敏感性(灵敏度)进行测试、评估和分类的程序。所有封装的半导体器件、薄膜电路、表面声波(SAW)器件、光电器件、混合集成电路(HICs)以及包含任何这些器件的多芯片模块(MCMs)都应按照本文件进行评估。为执行测试，器件被组装成类似于最终应用中预期的封装。本CDM文件不适用于插座式放电模型测试仪。本文件描述了场诱导(FI)方法。另一种直接接触(DC)方法在附录J中描述。 本文件的目的是建立一个测试方法，该方法将复制CDM故障，并提供可靠的、可重复的CDM ESD测试结果，无论器件类型如何。可重复的数据将允许准确分类和比较CDM ESD灵敏度水平。 [外文原描述]： IEC 60749-28:2022 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-28:2022 establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex J. The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels. This edition includes the following significant technical changes with respect to the previous edition: - a new subclause and annex relating to the problems associated with CDM testing of integrated circuits and discrete semiconductors in very small packages; - changes to clarify cleaning of devices and testers.