标准摘要
[中文适用范围]： IEC 60749 这一部分的目的是验证半导体器件的材料、设计、结构、标记和工艺是否符合适用的采购文件。外部目视检查是一种非破坏性测试，适用于所有包装类型。该测试对于鉴定、过程监控或批次验收或两者都有用。 [外文原描述]： Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The contents of the corrigendum of August 2003 have been included in this copy.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection