标准摘要
[中文适用范围]： IEC 60749 这一部分的目的是验证半导体器件的材料@设计@结构@标记@和工艺是否符合适用的采购文件。外部目视检查是一种非破坏性测试，适用于所有包装类型。该测试对于资格@过程监控@或批次验收非常有用。 [外文原描述]： IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance. This edition includes the following significant technical changes with respect to the previous edition: a) reference to the need for ESD protection; b) inclusion of information on the phenomenon of tin whiskers; c) inclusion of an optional report form/checklist.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination