标准摘要
[中文适用范围]： 建立标准程序，用于在可靠性测试之前确定非密封表面贴装器件 (SMD) 的预处理。该测试方法定义了代表典型的非密封固态 SMD 的预处理流程。 [外文原描述]： Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing