标准摘要
[中文适用范围]： 本文件确立了非气密性表面贴装器件在可靠性测试前进行预条件的标准程序。该测试方法定义了代表典型工业多次回流焊接操作的非气密性固态表面贴装器件的预条件流程。这些器件在提交特定的内部可靠性测试（资格认证和/或可靠性监测）以评估长期可靠性（受焊接应力影响）之前，需接受本文件描述的标准预条件序列。注1：根据IEC 60749-20和本文档，湿度诱导应力敏感性条件（或湿度敏感性等级）与实际回流条件的关联，取决于半导体制造商和电路板组装商之间相同的温度测量。因此，需监控组装过程中最热的对湿度敏感的表面贴装器件顶部封装体的温度，以确保其不超过评估组件时的温度。注2：就本文件而言，表面贴装器件仅限于塑料封装的表面贴装器件和其他由透气材料制成的封装。 [外文原描述]： IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3; - expansion of 6.7 on solder reflow; - inclusion of explanatory notes and clarifications.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing