标准摘要
[中文适用范围]： IEC 60749的本部分适用于半导体器件（分立器件和集成电路）。该测试的目的是确定设备是否由于过度过载而导致内部发热而着火。注：本试验与 IEC 60749（1996）第 4 章 1.1 中的试验方法相同，除了本节的修改、第 2 节和第 3 节的标题的增加以及重新编号之外。 [外文原描述]： Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to internal heating caused by excessive overloads. The contents of the corrigendum of August 2003 have been included in this copy.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)