标准摘要
[中文适用范围]： 本部分 IEC 60749 适用于半导体器件（分立器件和集成电路）。本试验的目的是确定器件是否因外部加热而点燃。该试验使用针焰，模拟设备中包含该器件时故障条件下可能产生小火焰的效果。 [外文原描述]： IEC 60749-32:2002+A1:2010 is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. This consolidated version consists of the first edition (2002) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)