标准摘要
[中文适用范围]： IEC 60749的本部分适用于半导体器件（分立器件和集成电路）。该测试的目的是确定设备是否因外部加热而点燃。该测试使用针状火焰，模拟可能由包含该设备的设备内的故障情况引起的小火焰的影响。注：本试验与IEC 60749(1996)第4章1.2中的试验方法相同，只是增加了本节、增加了第2和第3节的标题并重新编号。 [外文原描述]： Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. The contents of the corrigendum of August 2003 have been included in this copy.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)