标准摘要
[中文适用范围]： 范围和目的 进行无偏高压灭菌测试是为了评估使用湿气冷凝或湿气饱和蒸汽环境的非气密封装固态器件的防潮完整性。它是一种高度加速的测试，采用冷凝条件下的压力@湿度和温度条件来加速水分穿过外部保护材料（封装剂或密封件）或沿着外部保护材料和穿过其的金属导体之间的界面渗透。该测试用于识别封装内部的故障机制，并且具有破坏性。 [外文原描述]： The unbiased autoclave test is performed to evaluate the moisture resistance integrity of non-hermetically packaged solid-state devices using moisture condensing or moisture saturated steam environments. It is a highly accelerated test which employs conditions of pressure, humidity and temperature under condensing conditions to accelerate moisture penetration through the external protective material or along the interface between the external protective material and the metallic conductors passing through it.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave