标准摘要
[中文适用范围]： IEC 60749 的这一部分定义了对塑料封装电子元件进行声学显微镜检查的程序。该标准提供了使用声学显微镜以可重复且非破坏性的方式检测塑料包装中的异常情况（分层、裂纹、模具化合物空隙等）的指南。 [外文原描述]： Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components