标准摘要
[中文适用范围]： This part of IEC 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This document aims at prescribing a standardized test method and reporting procedure. This is not a component qualification test and is not meant to replace any system level drop test that is sometimes used to qualify a specific handheld electronic product. The standard is not meant to cover the drop test required to simulate shipping and handling-related shock of electronic components or PCB assemblies. These requirements are already addressed in test methods such as IEC 60749-10. The method is applicable to both area array and perimeter-leaded surface mounted packages. This test method uses an accelerometer to measure the mechanical shock duration and magnitude applied which is proportional to the stress on a given component mounted on a standard board. The test method described in IEC 60749-40 uses strain gauge to measure the strain and strain rate of a board in the vicinity of a component. The customer specification states which test method is to be used. [外文原描述]： IEC 60749-37:2022 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition: - correction of a previous technical error concerning test conditions; - updates to reflect improvements in technology.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer