标准摘要
[中文适用范围]： IEC 60749 的这一部分详细介绍了半导体元件封装中使用的有机材料的水分扩散率和水溶性特性的测量程序。这两种材料特性是塑料封装半导体在暴露于湿气和高温回流焊后有效可靠性能的重要参数。注：建议本标准中使用的吸湿参数从材料供应商（如树脂供应商）获取。 [外文原描述]： Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components