标准摘要
[中文适用范围]： 本部分IEC 60749详细说明了用于半导体组件封装中有机材料水分扩散性和水溶解性特性测量的程序。这两种材料特性是塑料封装半导体在暴露于湿气并经受高温焊料回流后有效可靠性性能的重要参数。 [外文原描述]： IEC 60749-39:2021 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-39:2021 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. This edition includes the following significant technical changes with respect to the previous edition: - updated procedure for "dry weight" determination.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components