标准摘要
[中文适用范围]： IEC 60749的这一部分提供了一种测试方法来评估在高温和高湿度环境下使用的半导体器件的耐久性。该测试方法用于评估塑料模制和其他类型封装中包含的半导体器件芯片的金属互连的耐腐蚀能力。它还用作加速由于湿气渗透钝化膜而导致的泄漏现象的手段以及作为各种测试的预处理。 [外文原描述]： IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage