标准摘要
[中文适用范围]： 本部分IEC 60749提供了稳态温度和湿度偏置寿命测试，用于评估非气密性封装半导体器件在潮湿环境中的可靠性。 该方法被认为是破坏性的。 [外文原描述]： IEC 60749-5:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test