标准摘要
[中文适用范围]： IEC 60749的本部分适用于半导体器件（分立器件和集成电路）。该测试方法的目的是确定半导体器件的泄漏率。注：本试验与 IEC 60749（1996）修订案 2 第 3 章第 5 节中包含的试验方法相同，只是增加了本节和第 2 节以及随后的重新编号。 [外文原描述]： Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing