标准摘要
[中文适用范围]： IEC 60749 这一部分的目的是测试和验证半导体器件上的标记在受到印刷电路板组装过程中去除助焊剂残留物过程中常用的溶剂或清洁溶液的影响时不会变得难以辨认。该测试适用于所有封装类型。它适用于资格和/或过程监控测试。该测试应被视为非破坏性的。电气或机械废品可用于本测试的目的。一般来说，该标记持久性测试符合 IEC 60068-2-45，但由于半导体的特殊要求，该标准的条款适用。注 1：此程序不适用于激光品牌封装。许多可用的溶剂要么活性不够，要么过于严格，甚至在直接接触或吸入烟雾时对人体有害。注 2：就通常的涂层和标记而言，本标准中使用的溶剂成分被认为是典型的并代表了所需的严格性。 [外文原描述]： Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive. The contents of the corrigendum of August 2003 have been included in this copy.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking