标准摘要
[中文适用范围]： IEC 60749 这一部分的目的是确定固态半导体器件上的标记在施加和去除标签或使用在去除助焊剂残留物过程中常用的溶剂和清洁溶液时是否仍保持清晰。印刷电路板制造过程。该测试适用于所有封装类型。它适用于资格和/或过程监控测试。该测试被认为是非破坏性的。电气或机械废品可用于此测试。注 1：此程序不适用于激光品牌封装。许多可用的溶剂要么活性不够，要么过于严格，甚至在直接接触或吸入烟雾时对人体有害。注 2：就通常的涂层和标记而言，本文件中使用的溶剂成分被认为是典型的并代表了所需的严格性。 [外文原描述]： IEC 60749-9:2017 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process. This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test. This edition includes the following significant technical changes with respect to the previous edition: a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions; b) additional variant – ‘adhesive tape pull test’.
英文名称Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking