标准摘要
[中文适用范围]： IEC 61188的这一部分旨在供电路设计师、封装工程师、印制板制造商和采购人员使用，以便所有人对每个领域都有共同的理解。封装的目的是通过导体将信号从一个设备传输到一个或多个其他设备。高速设计被定义为互连特性影响电路性能并需要独特考虑的设计。 [外文原描述]： The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
英文名称Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance