标准摘要
[中文适用范围]： 提供有关用于电子元件表面附着的焊盘图案几何形状的信息。本文提供的信息的目的是提供表面贴装焊盘图案的适当尺寸、形状和公差，以确保满足 [外文原描述]： Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
英文名称Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements