标准摘要
[中文适用范围]: IEC 61188 的这一部分提供了有关用于分立电子元件表面附着的焊盘图案几何形状的信息。该标准的目的是提供表面贴装焊盘图案的适当尺寸@形状和公差,以确保适当的焊料圆角@有足够的面积,并允许对所得焊点进行检查@测试和返工。每个条款都包含一组明确提出的特定标准,提供有关组件@组件尺寸@焊点设计和焊盘图案尺寸的信息。 [外文原描述]: Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
英文名称Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components